Sarjana Kejuruteraan Mikroelektronik

This course will explore the fundamentals of embedded system development effectively. Emphasis will be given to the embedded system hardware and firmware design in order to produce professional, highly maintainable and robust systems. This course will discuss the issues such as embedded processor selection, hardware/firmware partitioning, glue logic, circuit design, circuit layout, circuit debugging, development tools, firmware architecture, firmware design, and firmware debugging. The course is a combination of theory, hands-on, and participation, which will able to give a complete understanding of an embedded system.

This course emphasizes on numerical methods and computer program applications to solve problems. Statistical analysis methods that can be programmed in computers will also be taught. It is anticipated that students will learn about different approaches to solve engineering problems and be able to identify the ones that best applied to any given problem. The course is designed and implemented to help students apply open education technology including open educational resources (OER) and Web 2.0 to foster a lifelong learning culture.

This course aims to guide students to design the establishment of business. It provides expertise to review and apply the external factors that affect the business. Factors are applied from the inner corner through four business functions (finance, marketing, production and human resources). This course synthesizes the skill to produce a business plan through pitching and a business plan. Students are taught to build a business plan based on knowledge and experience about the economic environment and the exploration of business opportunities.

The aim of this course are to give knowledge and understanding on semiconductor physics, from the fundamental of semiconductor materials, energy band, charge carrier concentration and transport, p-n and metal-semiconductor junction and its applications such as MOSFET, MESFET, BJT, JFET, optoelectronics and other advanced devices.

This course emphasizes on numerical methods and computer program applications to solve problems. Statistical analysis methods that can be programmed in computers will also be taught. It is anticipated that students will learn about different approaches to solve engineering problems and be able to identify the ones that best applied to any given problem. The course is designed and implemented to help students apply open education technology including open educational resources (OER) and Web 2.0 to foster a lifelong learning culture.

This is a postgraduate level introductory course to integrated circuit (IC) design. Emphasis is given in understanding device characteristics, in particular the metal oxide semiconductor (MOS) transistor, which is the fundamental building block to IC design. The students will explore basic transistor characteristics such as transfer function, rise and fall time and power distribution. In addition, technology scaling, designing logic gates, designing for low power, interconnect, clocking and timing and arithmetic building blocks will be introduced to the students.

Transistor characteristics such as transfer function, rise and fall time and power discharge are given quantitatively. Technology scaling, designing logic gates, designing for low power, interconnect, clocking and timing and arithmetic building blocks will be explored. Emphasis will also be given on Op-amp application circuits and op-amp characteristics, two-stage op-amp, feedback circuits, frequency-response and stability of feedback circuits, and output stages.

The focus of this course is to acquire and apply knowledge, comprehension, and concepts in the field of integrated circuit fabrication process engineering. The topics covered will include the processing technology used for integrated circuit fabrication, integration processes for MOS-based fabrication technology, and final product packaging. The first part of the course will delve into Integrated Circuit Fabrication, including an introduction to cleanroom facilities and safety measures. It will cover various processes such as wafer cleaning, doping, diffusion, lithography, ion-implantation, material growth, metallization, and related issues.

The second part of the course will primarily explore finished product (i.e., Integrated Circuit) packaging-related issues. Emphasis will be placed on mainstream IC packaging methods like wire-bonding, TAB, and Flip-chip, along with preparation for packaging. By the end of the course, students will have a comprehensive understanding of Integrated Circuit Fabrication Technology.